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NxGen Electronics, Advanced Packaging Technologies
www.dodgedemonclub.com - 2009-04-03
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A free, neutral source providing micropackaging tutorials,articles, abstracts, technology updates, photographs, newsletter, supplier directory
bumped wafers  chipscale package  flip chip abstracts  flip chip articles  flipchip articles  flip chip information  flipchip information  flip chip literature 
www.flipchips.com - 2009-02-04
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UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
global.tessera.com - 2009-04-09
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BGA Socket Finder is an interactive database of our current footprints, searchable by positions, pitch, or manufacturer's device model number.
www.bgasocketfinder.com - 2009-02-12
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3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces ...
cavity down  memory stacking  multi chip package  substrate design 
www.broadpak.com - 2009-02-11
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Micro-Chip Scale Packaging (MCSP) competes in the rapidly expanding global electronic marketplace where its leading-edge technologies continue to increase ...
die level package  glass cavity  resistor capacitor on die  stacked IC  via in glass  wafer level chip scale package 
www.microcsp.com - 2009-02-12
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TechSearch International, Inc. is a consulting company that specializes in provding technical and marketing analysis in the semiconductor packaging industry.
www.techsearchinc.com - 2009-02-06
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Circuit Board Assembly Services, Electronic Prototypes, PCB, printed boards, Turnkey Production, Testing, CBAS is a local, high-quality, low-cost provider of ...
csp placement 
www.cbas-usa.com - 2009-02-13
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csp
for sale
land grid array
bga
ball grid array
abr
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